Enable photonics within the harshest environments
Already registered? Click here to login now!
Integrated photonics destined for extreme environments demands packaging that remains stable where polymer‑based approaches rapidly degrade. Dr. Klimov’s webinar introduces an epoxy‑free, high‑efficiency fiber‑to‑chip optical interface formed through hydroxide‑catalysis bonding, which enables reliable operation within extreme environments ranging from deep cryogenic temperatures and high vacuum to high-dose radiation environments. Packaged photonic chips preserve a 50-nm, 1-dB grating‑coupler bandwidth, withstand rapid thermal shocks to 77 K, and preserve light coupling efficiency through the bond interface after electron‑beam irradiation corresponding to a cumulative dose of 1.1 MGy. High‑temperature evaluation shows mechanically robust bonds survive 973 K annealing with axial strengths near 1 N/mm². This inorganic, platform‑agnostic method provides a durable pathway for deploying integrated photonics within the harshest sensing environments.
Speaker:
Dr. Nikolai N. Klimov
Senior Condensed Matter Physicist
Project Leader, U.S. National Institute of Standards and Technology's (NIST) Photonic Thermometry Program
Dr. Nikolai N. Klimov is a senior condensed matter physicist and Project Leader at the U.S. National Institute of Standards and Technology (NIST). His work integrates advanced nanofabrication, photonics, and quantum metrology to create next‑generation nanoscale sensors and primary standards that underpin U.S. measurement infrastructure.
He earned his M.S. in Physics and Applied Mathematics from the Moscow Institute of Physics and Technology (MIPT, Russia) and Ph.D. in Experimental Condensed Matter Physics from Rutgers University. He has authored 50 peer-reviewed publications, holds 8 patents, and has received multiple honors, including the Presidential Early Career Award for Science and Engineering (PECASE), two Department of Commerce Bronze Medals, and the NIST Distinguished Associate Award.
