Breaking the CPO Manufacturing Bottleneck: Modular Connectivity and High-Speed Multichannel Active Alignment

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The rapid growth of AI-driven data centers is pushing traditional networking hardware to its limits. To meet the demand for higher bandwidth and lower power consumption, the industry is transitioning toward Co-Packaged Optics (CPO). While CPO offers significant performance advantages, it introduces a major manufacturing challenge: how do you reliably connect, test, and assemble thousands of optical fibers onto a single silicon chip?

This webinar explores a collaborative solution to these "scale-up" challenges, featuring the latest innovations from SENKO, Santec, and Aerotech. We will discuss how moving away from fixed, permanent cabling toward a modular approach is essential for high-volume production.

The session is divided into two key areas:

• Intelligent Active Alignment: We will showcase the PICAlign™ solution, a joint effort that combines high-precision motion control with real-time optical instrumentation. You will learn how integrated software and hardware can reduce the time required to align complex fiber arrays from minutes to mere seconds, ensuring maximum signal efficiency with minimal manual intervention.
• Innovative Detachable Connectivity: We will introduce SENKO’s latest detachable connectors designed specifically for photonic integrated circuits (PICs). Unlike traditional methods, these connectors allow for "plug-and-play" capability at the chip level. This modularity is a game-changer for the supply chain, enabling easier wafer-level testing and protecting expensive optical engines from damage during the assembly process.

Join us to discover how these advancements in connector design and automated alignment are paving the way for the next generation of AI infrastructure, making mass-market CPO deployment a reality.