Ultra-High-Power InP Devices for Next Generation AI Data Centers
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AI training, cloud computing, and high-performance workloads continue to push data center architectures toward higher bandwidth density, greater link reach, and improved energy efficiency. As optical interconnects evolve toward co-packaged optics (CPO), external laser small form factor pluggable (ELSFP) engines, and disaggregated photonic systems, thermal robustness and higher optical power becomes integral to next-generation infrastructure.
SemiNex’ Ultra-high-power O-band semiconductor optical amplifiers (UHP SOAs) exceeding 1W saturation output power provide the optical headroom required to support centralized light-source architectures, increased channel counts, and higher I/O throughput. Advances in epitaxial design, waveguide engineering, and thermal performance enable >1 W optical output with power conversion efficiencies above 25%, supporting operation in high-temperature environments typical of hyperscale deployments. Together with high power CW DFB laser diodes, SemiNex provides an InP platform for next generation CPO and ELSFP.
Ease of integration with silicon photonics enables flexible system design while improving link margin, reducing component count, and optimizing power budgets. High-power DFB and SOA play an increasingly important role in enabling scalable, energy-efficient optical connectivity for AI-driven data center networks and future high-bandwidth compute fabrics.
Topics:
- AI data center market dynamics
- AI data center economics over the next 2 years
- Where InP devices play in the AI data center
- Design considerations for next-generation optical interconnects and compute fabrics
- Data center and AI bandwidth scaling challenges and optical power requirements
- Role of high-power DFB and SOAs in enabling higher I/O throughput and GPU interconnect density
- Broad gain bandwidth and implications for flexible system design
- SemiNex high power InP portfolio
- Ultra-High-Power SOA performance metrics with high PCE
- CW high power DFB laser diodes
- Integration pathways, multi-channel arrays for scalable photonic systems
Speakers:
Daniel Chu, Ph.D.
Vice President of Marketing and Product Management
SemiNex
Dr. Daniel Chu serves as Vice President of Marketing and Product Management for SemiNex, where he shares his technical laser expertise and marketing knowledge to assist customers in developing best-in-class laser systems. He is a laser physicist with extensive experience in semiconductor laser product management and applications engineering, which he developed over more than 30 years working in the laser diode and photonics industry including tenures at well-known companies such as OSRAM and SDL. He has published over 30 papers and presentations in various conferences and technical journals. Dr. Chu holds a master's degree and a doctorate in electrical engineering from Northwestern University.
Gyo Shinozaki
Chief Strategy Officer
SemiNex
Gyo Shinozaki serves as Chief Strategy Officer at SemiNex, where he brings decades of experience in photonics and optical communications to support the development of high-performance optical solutions for AI and data center infrastructure. He is an industry veteran with deep expertise in optical sources, semiconductor optical amplifiers, and the system-level requirements for scaling bandwidth and power efficiency in next-generation interconnects. Prior to SemiNex, he served as Executive Vice President and General Manager of Ortel, a Photonics Foundries company, advancing high-performance optical source and amplifier technologies for communications and sensing. Also having led EMCORE’s Broadband Division, he managed global optical component portfolios for telecom, cable, and data communications markets, and brings extensive knowledge of bringing optical technologies from development to deployment.
