Latest Advances in Laser Drilling of VIA holes

This educational webinar explores the latest advances in laser drilling of VIA holes — key to enabling higher bandwidth communication and compact device footprints. Led by laser and motion experts, the session is designed to equip engineers and managers in semiconductor, photonics, optics, and medical device manufacturing with key technology knowledge. We'll examine common VIA materials, shapes, and highlight core challenges, such as hole geometry and maintaining precision at high speeds.

Attendees will gain insight into methods for overcoming these hurdles through fixed-optic configurations, advanced motion control, and laser-to-motion synchronization. Real-world examples, including glass wafer drilling, illustrate how these solutions deliver results. To conclude, we’ll preview emerging innovations — such as XL SCAN, 3D error correction, and hybrid piezo motion — that hint at the future potential for even faster and more accurate manufacturing.