OpTek Systems to display laser cleaver at LASER World of Photonics 2015

The LaserCleave laser cleaver prepares and terminates optical fibers using a non-contact laser process to avoid the potential for mechanical damage and deliver a surface free of chips, cracks, scratches, and other surface defects. This helps to improve laser damage threshold, particularly at higher power levels.

LASER World of Photonics booth number: B2.203

To Learn More:

Contact: OpTek Systems
Headquarters: Abingdon, Oxon, England
Product: LaserCleave laser cleaver
Key Features: Non-contact laser processing

What OpTek Systems says:
View more information on the LaserCleave laser cleaver.

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