DataRay to showcase line laser profiling system at SPIE BiOS and SPIE Photonics West 2017

Jan. 19, 2017

The Line Laser Profiling System (LLPS) is a complete solution for analyzing line lasers up to 200 mm in length and down to 55 µm in width.

LFW Staff

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The Line Laser Profiling System (LLPS) is a complete solution for analyzing line lasers up to 200 mm in length and down to 55 µm in width. By scanning the company's WinCamD-LCM4 beam profiling camera across the length of the beam using its 50 or 200 mm linear stage, the software will display a full image of the line laser intensity distribution along with a vertical centroid plot, line width plot, and several other useful measurements.

SPIE BiOS/Photonics West booth number: 8410 (BiOS) and 1840 (Photonics West)

To Learn More:

Contact:DataRay
Headquarters: Redding, CA
Product: Line Laser Profiling System (LLPS)
Key Features: Displays a full image of the line laser intensity distribution

What DataRay says:
View more information on the Line Laser Profiling System (LLPS).

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About the Author

LFW Staff

Published since 1965, Laser Focus World—a brand and magazine for engineers, researchers, scientists, and technical professionals—provides comprehensive global coverage of optoelectronic technologies, applications, and markets. With 80,000+ qualified print subscribers in print and over a half-million annual visitors to our online content, we are the go-to source to access decision makers and stay in-the-know.