LASER-DIODE FABRICATION: Alignment and etching techniques assist fabrication of edge-emitting laser diodes

A photolithography-based method for chip singulation avoids drawbacks of mechanical cleaving and enables on-wafer testing.

A photolithography-based method for chip singulation avoids drawbacks of mechanical cleaving and enables on-wafer testing.
CRISTIAN B. STAGARESCU, VINU VAINATEYA, ALFRED T. SCHREMER, ALEX A. BEHFAR of BinOptics (Ithaca, NY), and RICH TRAVERS, RODNEY CHISHOLM, AND FRED HAFNER of ASML (Veldhoven, The Netherlands)

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