December 5, 2024
11:00 AM ET / 10:00 AM CT / 8:00 AM PT / 4:00 PM GMT
Duration: 1 hour
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Summary
This webinar presents a low-cost package solution that can replace butterfly packages used in photonics. The solution is based on existing air cavity plastic package technology used in RF power applications and offers additional flexibility in geometry and leadframe/heatsink materials combined with shorter prototype delivery times, and near-hermetic package performance.
Speaker
Sander Dorrestein
Program Manager of the Integrated Photonics
Chip Integration Technology Center
Alexander (Sander) C.A.J. Dorrestein is the program manager of the Integrated Photonics at Chip Integration Technology Center (CITC). He is a mechanical engineer with a special interest in micro-assembly processes and technologies. He has broad experience in the field of packaging technologies for both micro-electrical and micro-optical packaging. He has a proven track record of developing bonding and joining processes that are currently used in production for consumer, medical, industrial, and automotive applications.