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Laser Industry News 2008 p1:

• Laser Focus World and OIDA to hold "green" optics conference, OPTOmism
  July 25, 2008--The photonics-industry trade publication Laser Focus World (Nashua, NH) and the Optoelectronics Industry Development Association (OIDA; Washington, DC), a not-for-profit association that serves as the nexus for vision, transformation, and growth of the photonics and optoelectronics industry, will hold a new conference and exhibition, OPTOmism.
• Sandia seeks to commercialize its hyperspectral confocal fluorescence microscope
  July 25, 2008--Sandia National Laboratories (Albuquerque, NM) will demonstrate its new hyperspectral confocal fluorescence microscope Friday, August 8 from 9 a.m. to 2 p.m. MDT (mountain daylight time) in Bldg. 897 on Kirtland Air Force Base.
• Universal Display Corp wins $1.9 M contract to develop white OLED products
  July 24, 2008--The U.S. Department of Energy has awarded a $1.9 M contract to Universal Display Corporation to combine its energy-efficient UniversalPHOLED and other OLED technologies with the product design and engineering expertise of Armstrong World Industries to create an integrated ceiling lighting system.
• Optics researcher elected to Russian Academy of Sciences
  July 23, 2008--The Russian Academy of Sciences (Moscow, Russia) has elected Roger Stolen, a distinguished visiting professor in materials science and engineering at Clemson University (Clemson, SC), as a foreign member.
• Nextreme awarded NC Green grant to improve its thin-film thermoelectrics
  July 23, 2008--Nextreme Thermal Solutions (Durham, NC), provider of microscale thermal and power management products, was awarded a grant from the North Carolina Green Business Fund to enhance the efficiency of its thin-film thermoelectrics that convert waste heat into electricity. Nextreme's technology can be incorporated into tiny laser diode and optoelectronic components, unlike standard and bulkier thermoelectric cooler technologies.
• Gigaphoton installs 100th argon-fluoride lithography light source
  July 23, 2008--Gigaphoton (Oyama, Japan), a lithography light-source manufacturer for the semiconductor industry, installed its 100th GigaTwin argon-fluoride (ArF) light source platform at a major semiconductor foundry in Taiwan. The company says the milestone is a testament to the success and growing adoption of Gigaphoton's dual-chamber platform, which also features the company's injection-locking laser technology.
• Cymer's OnPulse LaserLife Program covers 900 installed lithography light sources
  July 23, 2008--Cymer (San Diego, CA), supplier of light sources used by chipmakers to create advanced semiconductor chips, announced that chipmaker customers in Asia, North America, and Europe have added its OnPulse LaserLife Program to more than 900 of Cymer's 3,300 installed light sources. The program improves wafer production, reduces total operating costs, enhances laser cost predictability, and simplifies administration.
• SEMICON West marches to the relentless beat of Moore's law
  July 22, 2008--It was obvious that Moore's law and its relentless march towards finer and finer feature sizes on integrated circuits was once again the overriding theme of SEMICON West 2008, held July 15-17 in San Francisco, CA. This year's show was also co-located with Intersolar North America for the first time, allowing SEMI (San Jose, CA) to expand its technology focus from the traditional semiconductor industry into the exploding photovoltaic market.
• Cymer CEO Bob Akins named chairman of the SEMI International Board of Directors
  July 18, 2008--At this week's SEMICON West conference in San Francisco, Cymer, developer of light sources for semiconductor lithography, announced that its CEO and co-founder Bob Akins was elected chairman of the SEMI International Board of Directors. Vice chairman of the board in 2007, Akins succeeds Jerry Coder, president emeritus of the IC Fab Materials Business Unit of Dupont Electronic Technologies, who served as the board's chairman for the past year.
• Qualcomm and IMEC collaborate on 3-D chip design research
  July 18, 2008--Europe's independent nanoelectronics research institute IMEC (Leuven, Belgium), and Qualcomm Incorporated (San Diego, CA), a developer and innovator of advanced wireless technologies and data communications solutions, announced that Qualcomm is the first fabless integrated circuit (IC) company to participate in IMEC's industrial affiliation program (IIAP) on three-dimensional (3-D) integration as a means to future semiconductor IC design.

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