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Laser Product Highlights 2004 p1:

  • Nikon introduces spectral imaging system for cell biology
    December 8, 2004, Melville, NY--Nikon Instruments has announced a Digital Eclipse C1si confocal laser fluorescence microscope system that can simultaneously acquire the fluorescence spectrum over a 320-nm wavelength range in at 10nm spectral resolution or over smaller ranges at 5-nm or 2.5-nm spectral resolution.
  • TDI introduces sapphire AlGaN substrates for UV emitters
    November 30, 2004, Silver Spring, MD--Technologies and Devices International, Inc. (TDI), a privately held Maryland corporation, is presenting its new product prototype, aluminum gallium nitride (AlGaN)-on-sapphire templates, at the 2004 Material Research Society (MRS) Fall Meeting and Exhibits (Boston, MA; November 30 through December 2, 2004).
  • Opto Diode introduces 99-die LED array
    November 18, 2004, Newbury Park, CA--Opto Diode has introduced a new 99-Die LED array product line. According to the company the family of products features excellent thermal conductivity and a 110-degree beam angle. The six new devices are available in varying wavelengths with typical peak responsivity of 405, 470, 525, 610, 830 and 870 nm.
  • New packaging for IR emitter diodes and detectors
    November 10, 2004, Regensburg, Germany--OSRAM Opto Semiconductors has announced new packaging technology for its infrared (IR) emitter diodes and detectors. The surface-mount technology (SMT) devices, Molded Interconnect Device Light Emitting Diodes (MIDLEDs), have a unique construction that offers electrical contact pads on both the bottom and side of the package.
  • Toshiba introduces compact surface-mount photocoupler
    November 8, 2004, Irvine, CA--Expanding its packaging line-up for optoelectronic products, Toshiba America Electronic Components (TAEC) has introduced a compact, high-speed, surface-mount MOSFET/IGBT gate driver photocoupler. The Toshiba TLP701 is housed in a new SDIP package that occupies half the space of standard 8-pin DIP devices.
  • Terahertz reveals all
    Olching, Germany, Oct. 26, 2004--Laser Components GmbH has commercially introduced a terahertz quantum-cascade laser for both spectroscopic and security applications.
  • Photodetectors target optical communication networks
    Richardson, TX, October 21, 2004--Anritsu has introduced AD14113 and AD14109 photodetectors designed for high sensitivity and strong resiliency to optical overload. They are intended to suit design needs for 10 Gbit/s optical transmission systems, such as SDH/SONET networks.
  • Photodiode has high sensitivity to vacuum ultraviolet light
    Bridgewater, NJ, October 14, 2004--Hamamatsu has introduced the S9089, a silicon (Si) photodiode with a quartz window that gives it improved sensitivity to vacuum ultraviolet (VUV) light compared to conventional Si photodiodes. The S9089 has been designed for argon fluoride (ArF) and krypton fluoride (KrF) excimer laser measurement applications and for general UV light detection.
  • New tool profiles high power industrial lasers
    San Jose, CA, September 30, 2004--Photon a manufacturer of beam profiling optical test equipment, has annoumced a new tool for profiling high power industrial lasers, the High Power NanoScan. The device analyzes CO2 lasers up to a few kilowatts of power, as well as Nd:YAG and other commonly used industrial lasers up to a few hundreds of Watts power.
  • Tool quickly measures mass-produced aspheric lenses
    Wedel, Germany, September 28, 2004--Fabricating mass-produced aspheric lenses for digital cameras and mobile phones is far different from crafting laboratory-use optical elements, because surface-shape measurements of high-volume lenses have to happen fast. In response to this need, Trioptics has announced the availability of a laser-scanning based lens-characterization tool (the AspheroMaster) that measures 3-D surface shape and wavefront profiles swiftly and accurately.
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