Tucson, AZ—Including a recent $3M order for 3D microscopes for display testing, Bruker’s Nano Surfaces Division has now received more than $7M in total orders for its Bruker SP9900+ high-throughput high density interconnect (HDI) substrate metrology system, which is a large-format 3D optical microscope specially designed for the semiconductor packaging industry. Bruker says dramatic improvements in inspection throughput are provided by the system’s areal coverage of up to 600 square millimeters and traverse speeds up to 50 millimeters per second.
"Manufacturers of multichip modules (MCM) and high pin count semiconductor chips are continually increasing panel sizes, reducing feature sizes and increasing the pin count of their products, which creates new challenges in process control for high-volume production," said Mark R. Munch, president, Bruker MAT Group and Bruker Nano Surfaces Division. "The most important areas typically involve measurement of traces, vias, and interconnects, as well as the surface roughness of copper and Ajinomoto build-up film. Working closely with our customers, we've been able to reduce the 'time to measurement' for these critical inspection challenges to less than one half of previous generation systems."
"The new SP9900+ provides radical improvements in measurement speed due to its faster traverse speeds, faster autofocusing, faster camera, revolutionary fixture-loading mechanism and augmented auto intensity function," added Rob Loiterman, executive VP and GM of Bruker's Stylus and Optical Metrology Business. "We've optimized the system to maximize factory throughput while ensuring the most accurate measurements which should help our customers improve yield and keep lowering the cost of consumer electronics."
SOURCE: Bruker; www.bruker.com/news-records/single-view/article/bruker-wins-over-7-million-in-sp9900-3d-optical-microscope-orders.html
