IPG Microsystems micromachining platform accepts multiple types of ultrafast lasers

The IX-6168-PS picosecond laser platform accepts multiple types of ultrafast lasers with pulse lengths from 5 to 500 ps. Laser choices include IR, green, or UV wavelengths, and a range of power and pulse rates. The platform has both fixed beam and galvanometer scanning capability.
IPG Photonics, Microsystems Division (IPG Microsystems)
Manchester, NH
[email protected]

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PRESS RELEASE

IPG Photonics, Microsystems Division Introduces Picosecond Laser Micromachining System

Manchester, New Hampshire, USA– IPG Photonics, Microsystems Division (IPG Microsystems), commences shipment of its picosecond laser based micromachining tools. Utilizing lasers having pulse lengths in the range of 5 to 500 picoseconds, the equipment enables users to achieve high-quality machining of glass, ceramics, metals and alloys, and other hard to process materials.

The IPG Microsystems picosecond laser platform, the IX-6168-PS, is designed to accept multiple types of ultrafast lasers, keeping with IPG Microsystems’ product philosophy of selecting the best available laser for the individual customer application. The laser is accommodated in a slide-out service trolley within the workstation, and is fully integrated with the system control software. Laser choices include Infra-red (IR), green or UV wavelengths, and a range of power and pulse rate options.

To maximize tool flexibility, IPG Microsystems provides a dual beam delivery configuration. For highest precision machining, a fixed-beam configuration can be used that produces a finely focused beam, and utilizes the precision air-bearing stage for precise feature positioning. Alternatively, for high-speed processing of complex shapes, a high-accuracy galvanometer configuration incorporating a step-and-scan function may be preferred. The IX-6168-PS is delivered with both fixed beam and galvanometer scanning capability, and can be easily reconfigured on site to suit individual needs.

With ultrafast laser processing, the pulse duration is shorter than the thermal diffusion timescale of the material, resulting in a direct solid to vapor transition that greatly reduces debris formation, and minimizes thermal impact on the surrounding area. This makes the technology ideal for materials that are otherwise hard to machine, and where the quality of the end result is of paramount importance.

The IX-6168-PS can be supplied as a manual-load system, or combined with IPG Microsystems' Integrated Automation Platform for fully automated operation in semiconductor wafer applications. Configuration options include laser wavelength, power and repetition rate, and a choice of galvanometer scanner and lens systems to optimize large deflection field applications.

IPG Microsystems products and services include UV excimer, DPSS and ultra-fast laser micromachining systems, UV and VUV laser beam delivery systems, laser materials processing development, optical damage testing, and excimer laser refurbishment services. IPG Microsystems operates a high-performance laser job shop as well as a systems engineering and manufacturing business. For more information, visit www.jpsalaser.com, or contact the company at 220 Hackett Hill Road, Manchester, NH, 03102 USA; Tel. 603.518.3200, Fax 603.518.3298.

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